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Via Hole Filling System

Designed to fill holes in substrate with conductive or non conductive paste. And equipped with glass cover for safety and visual quality control, both side of panels can be fill in one cycle.

To ensure quality, the system automatic scavenger system will remove excess plugging paste from the surface of the printed circuit board. Once again, it is equipped with glass cover for safety and visual quality control

 
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NICA TECHNOLOGIES INDIA P.LTD.

Address: C-104, Ll Block, Kssidc Complex, Electronics City, Hosur Road
Bengaluru-560100

E-mail: Send E-Mail

Web: www.goldenpages.in/nica

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