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| Desmear And Metallization |
Desmear and metallization
Integrated wet chemical solutions for all key market segments including IC substrates, HDI/MLB and Flex/Flex-Rigid
Quick facts
Global market leader for horizontal high end HDI manufacturing
Worldwide market reference for desmear processes in all market segments
Over 100 vertical and 230 horizontal lines are running in mass production with our electroless copper processes
Applications
Desmear
Horizontal electroless copper
Vertical electroless copper
Direct plating
Metallization of glass substrates
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| Panel And Pattern Plating |
Panel and pattern plating
Complete solutions for all aspects of package substrate and HDI production
Quick facts
Electrolytic plating for the highest requirements in reliability and productivity
Solutions for various equipment types: Uniplate® IP2, vertical conveyorised lines, conventional hoist type
Market leading Uniplate® IP2 equipment for horizontal conveyorized production
Applications
Conformal plating
BMV filling
TH filling
Pretreatment
Metal resist, electrolytic final finishes
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| Final Finishing |
Final finishing
Coping with the harsh environment of multiple Pb-free soldering
with a complete line of final finishes
Quick facts
Highest global market share for final finishing
Complete portfolio of final finishes
Production proven lead free processing
OEM relevant development
Applications
ENIG
ENEPIG
EP/EPAG
Immersion Tin
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| Bonding Enhancement |
Multibond®: This Black Oxide process can be operated over a wide range of temperatures and dwell times to produce a variety of bonding properties, depending on the specific applications.
BondFilm®: Atotech’s simple and economic oxide alternative process for improved inner layer bonding. With over 400 lines and installations worldwide Atotech leads this market segment globally and contributes to the success of many key PCB manufacturers.
Secure HFz: A non-etching adhesion promoter that achieves better or comparable performance to existing etch-based enhancement processes that specifically targets IC-Substrates and high frequency applications. Secure HFz ensures enhanced bonding between copper layers and the dielectric materials used in multilayer and chip carrier manufacture. This results in excellent peel strength while also providing resistance against chemical attack.
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| Booster Mr |
Enabling technology for direct metal deposition on molding resin: Booster® MR is a unique wet-chemical adhesion enhancement process for primer-less metal plating directly on molding resins. Direct plating on molding resin enables applications for conformal electromagnetic interference (EMI) shielding and “direct circuit formation” on molding resins, such as for FO WLP (FO PoP, FO SiP). The Booster® MR process can handle singulated and strip based products, using tape carriers to prevent the I/O side from being attacked by the plating solutions.
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| Plating Tool Multiplate |
MultiPlate®: Atotech’s first semiconductor plating tool addresses future industry requirements such as cost effectivity and superior process performance for manufacturing of electrochemical packaging solutions. MultiPlate® is designed for single and double sided plating, through hole filling and high speed pillar plating. The tool is compatible with both wafer and panel size substrates (silicon, glass, etc.) and can be customized according to the individual production requirements.
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| Permanganate Desmear |
Equipment highlights:
High quality stainless steel sweller and permanganate modules ensure maximum process stability and low maintenance
Integrated stainless steel filtration system for sweller and permanganate
Designed to save resources – Chemical regeneration system for continuous production at stable process parameters (Oxamat® for permanganate regeneration) and sophisticated rinse concept
Strong process performance with flood bar technology
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| Acid Zinc Electrolytes |
Features and benefits
High efficiency and greater plating speed
High gloss coatings with superior coverage
Decorative appearance resembling chrome
Comparatively low plating cost
Boric acid-free processes available
High temperature stability
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| Plating On Plastics |
Features and benefits
Comprehensive solutions for plating on plastics
Adhemax® for conventional plating ABS, PP and ABS/PC blends with outstanding selective plating properties
Reduced number of process and rinsing steps for direct plating ABS and ABS/PC blends with NeoLink®
Adhemax® PA for plating on polyamide (PA)
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| Hard Chrome Electrolytes |
HEEFhard chrome systems
Worldwide leading proprietary hard chrome process based on the use of high purity, patented additives
Properties of the deposited coatings are continuously matched to current industrial requirements
Highly economical due to improved current efficiency
Excellent wear resistance and high level corrosion protection
Increase in component lifetime
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| Pb And Cd Free Electroless Nickel Processes |
ELV, WEEE and RoHS compliant
Nichem® 11 product range allows electroless nickel plated parts to be recycled safely
Pb and Cd-free deposits for all applications within the automotive, electrical and electronics industries
Comparable or even better performance next to traditionally stabilized electroless nickel processes
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| Ic And Leadframes |
Features and benefits
Innovative solutions for leadframe roughening, tin plating, ultrathin Ni/Pd/Au and high-speed silver plating
Highest MSL level performance
Whisker prevention
Low-to-zero free cyanide high-speed alternative for plating matt silver over leadframe surfaces
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| Paint Pretreatment |
UniPrep® – long life, low temperature cleaners
Low temperature operation
Extended cleaner life
Maintains stable performance throughout cleaner life
Interlox® – phosphorus-free paint adhesion promoters
Superior process stability
Multi-metal application capabilities
Low temperature operation
Minimal sludge and scale formation
Phosphorus-free
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| Contributing To A Sustainable Production |
For 60 years Atotech has designed and produced systems for the plating industry at the Atotech site in Feucht close to Nuremberg (Germany) and since 2003 also in Guangzhou (China). Chemical and equipment engineers work closely together to assure the compatibility of chemical processes and lines. Atotech’s equipment technology contributes to minimize energy consumption e.g. with optimized exhaust air system and wastewater reduction, efficient pumps and motors, in combination with control system intelligence.
A team of Atotech equipment and process specialists audits existing plating systems and develops proposals to optimize throughput, automation and quality. Based on the diverse production requirements and conditions, our experts set up tailor-made consulting packages including training, a hotline, service and
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